All language subtitles for captions_USB_presentaion_andrewduda

hi there this is grant jennings from goin
semiconductor and today i'm going to walk through

our usb solutions and roadmap and particularly
talk about a new solution that we have which is

a usb 2.05 capable of high speed interfacing
at 480 megabits per second for the usb 2 spec

this is a one of a kind solution you know no other
fpga company in the world has it has ever done it

and so we're very excited at going for it being
the innovative fpga semiconductor company so let's

get started the agenda here is we're going to go
through just a brief overview to kind of align

everybody on goin products so i'm just gonna give
a very brief overview of gohan's product portfolio

and then i'm going to talk about new products
and solutions coming soon then we'll go into some

focused usb solution discussions and an
update there and we'll go a little bit

deeper into our usb 2.0 solutions including
the phi as well as the link layer or sie

as it's called in the usb specification and
then we'll go into a usb solution road map

this is just kind of where now that we have usb
2.0 and you're capable of using it on any go on

fpga what are some of the demos and solutions that
will be coming available in the months to come and

the rest of this year and then we'll go into some
use case examples uh we'll talk about development

boards and how you can actually and your customers
can actually test out the usb 2.0 solution

and then we'll go into uh where you can get
some support for for go and design services

and uh just a little bit of some links to
some other resources that may be useful

so let's get started uh first let's go into the
product summary and i tried to just keep that this

we have other slides that you may have seen from
sales that kind of go through a table of different

capabilities but i wanted to keep it really
simple as of today we have two product families

a non-volatile family and a volatile fpga family
family so non-volatile it has embedded flash

typically smaller density great for interfacing
and bridging type applications we also have you

know devices with some extra capabilities but
this is all in the 1 to 20k lookup table range

um so before it was 1 to 10k it's actually a new
device that pushes us up to the 20k range which is

pretty unique in uh in the market right now
then traditional fpgas we have a 20 to 55k

lookup table range a little bit higher
performance fabric more io and uh you

know some other capabilities that are not on
the non-volatile but you don't get the flash

so then within that one of the unique things about
going semiconductor is our hybrid fpgas so if you

see in the part number an s that means that it has
an embedded hardened cortex m3 hardcore processor

if you see an r in the product name that means
that it has an embedded extended user memory

and it can be around 4 to 16 megabytes depending
on the device chosen it could have varying bus

widths and it could be varying types of memory
it can be psram sdram or ddr so you can choose

the right type of memory for your application
you can also have extended embedded user flash

e-series is our security fpgas and these
have a puff based embedded security

core within them and that basically means that
the key generation is asynchronous key generation

and the keys are generated at power
up based on sram puff technology

and then we have rf series um gw1 rf series so
if you see a rf in the series name that's an

fpga plus a hardened mcu and plus a bluetooth low
energy transceiver 5.0 to be specific so hopefully

that just that's pretty much going semiconductor
product line from the devices in a nutshell

so now we're going to talk about new and
upcoming semiconductor products so these

are new devices that are either here now or uh
coming soon so first we have the gw2 an 18x so

this is an 18k uh it's actually 20k um the the
titles the part number's a little deceiving

so there's a few extra luts but around a 20k
lookup table device um that's non-volatile

and it has very fast boot up um from the
embedded flash it has embedded security

so it has the puff base security and it also has
pin compatibility to other semiconductor devices

then we have the gw1n2 now this is a 2k
non-volatile device and the key thing about

it is that it has two gigabit per second rx and
tx mippy d5 hardcores so you have true mippy rx

at up to two gigabits per second and the speed
on that we know at least uh two and we're

working to to get a little bit more using the
pre-emphasis capability and then on the tx side

you have true uh slvs 200 high speed and 1.2 volt
low power mode capabilities to provide a true

mippy d5 interface so that's really good and also
those uh one and two i believe that there are some

r series of that so if you need some frame
buffering in there this device is really for

video bridging and uh video interfacing as well as
some processing and you know it's pretty common to

sometimes need a frame buffer in those use cases
so the r series is available for that as well

automotive devices so we have our first automotive
devices and we have a 1k non-volatile as well as a

20k volatile fpga to kind of cover the automotive
space and these devices are aec100q qualify

assps so this is something new to go in but
we have a series of application specific chips

coming out um the first round of them is really
specific to usb to another interface bridging for

basically programmer cables and programming
so we have a usb to j tag we have a usb to spy

we have a usb to ur and we have a usb to
is i2c assp so you can look forward to that

you know there are some of these bridging chips
that are readily available particularly like usb

to uart just due to programming microcontrollers
but other cases like usb to jtag usb to spy

and usb to ic there's a lot fewer solutions
on the market and as a result the devices

are a little bit more expensive so we
think that our assps provide a really

good um affordable and competitive
competitive solution in the market um

and so we're really excited about that and
then the last um you know kind of updated

product um silicon product update is that is the
x series so we have several devices that provide

pin for pin compatibility to devices that are
either ended end of life long lead time or um

for customers that are using an existing device
but would like to add some new features some new

capabilities and they need larger density but
also pin compatibility really is helpful to them

i need to make one more product update
regarding a legacy device the gw1ns2

this is different than the gw1n2 that is just
being released with the hardened d5 cores

the gw1 and s2 was a 2k lookup table fpga with
hardened cortex m3 and hardened usb 2.0 phi

this device has had some issues related
to the foundry that it was fabricated on

all of our production devices are fabbed on tsmc
however this other device was was fabricated at a

different foundry and that led to some issues
so it's been kind of still on the roadmap to

get it working and it still technically is however
one of the major things that's broken on it is the

usb 2.0 hard fi in 2.0 mode and we after that
we released a gw1 and s4 which still has the

hardened cortex m3 but it doesn't have the usb 2.0
hard fi and then now we have the usb 2.0 software

which works just as well so there's a good chance
that the gw1 and s2 will be discontinued because

we have the 4k which is an overall lower
cost but more resource intensive device

and we have the usb 2.0 software solution which
can be used on all of the current go and devices

so it's very likely that we will discontinue that
device as the two features are already covered in

a broader spectrum with the tsmc foundry devices
so that's kind of updated semiconductor products

um from going let's let's go into uh some
solutions update so this is not all of the

solutions that are kind of coming down the
pipeline but it's a few that i thought were

notable there's several solutions going on
right now it's pretty exciting what has been

being developed with our devices and
how much they've matured and advanced

over the last you know few years so
first is a foc motor control ip solution

so this is an industrial motor control
solution providing high precision and parallel

feedback loops for controlling multiple motors you
can show one more or two but one of the you know

situations that our customers tend to gravitate
towards this solution over other motor control

solutions is when they run into an issue where
they need to either increase the number of

i o that the cpu have and particularly
the the types of interfaces so the adcs

and some of the gpios and encoder links like rs485
i believe they need to increase the number of

of interfaces for multiple motors and then
also the cpu needs to increase in performance

to accommodate these motors and typically the
cpu has to kind of dedicate itself to to the to

each individual motor and give it with a real-time
operating system give it preference and priority

because if you start running some other
application it starts bogging down the system and

you don't have a real-time operating system your
motors could start slowing down and going all over

the place so what the fpga solution provides is an
fpga either in between the cpu and the motors or

the mosfet drivers or you can actually embed the
cpu inside the fpga and have a one chip solution

what whatever your preference is um but each motor
control loop runs it completely independently and

that we provide an api for the cpu to call each
of the current control loop modules so this way

there's no no bog down on the cpu and the motors
can run independently and when you need to make

an adjustment that api call just adjusts that
motor and that current control loop in the fpga

so it's very um good solution and provides a lot
of higher precision control at a i would say a

much more cost-efficient overall bomb solution
we also have a simple motor control ip this is

for doing just very simple
motors like maybe in toys or

consumer applications and we actually have this on
the gw1 and rf so you can actually control a motor

through bluetooth low energy or multiple motors
for smaller motors for consumer applications so

that's pretty unique and pretty interesting then
we have go ai 2.0 which is our machine learning

inference and npu solution and hardware ip so we
have several new demonstrations that have come out

over the last year person detection car detection
digit detection analog meter detection multiple

digit detection different input sources so you
know different cameras different hdmi inputs audio

audio classification gesture control several
demos and there's there's some next generation

stuff coming that you can look forward to on that
basically mainly around improving performance

but i would assume some additional
demos that you can look forward to there

and then lastly the image signal processor ip so
this is if you're if you're not aware when you

have a system with an image processor sorry
when you have a system with an image sensor

a lot of times there is not an image
processor built into that image sensor

so the data that you get from the image sensor is
just raw pixel data and that pixel data needs to

be processed using an image signal processor now a
lot of times this is built into an soc or you know

a larger processor device there are dedicated
image signal processors as well but if you're

doing any sort of image processing on fpga you
need a in a lot of cases you need a image signal

processor pipeline if you want the image to look
good some cases you don't need it um you know if

like in the case of go ai if you if you train the
model to accommodate that that you could remove

those resources and not need the image processor
but in a lot of cases if you're going to output

that image and use it for something or display
that image coming from the camera you need an

image signal processing pipeline to make the image
look correct so that's a great new additional iep

and then the usb 1.1 2.0 and the phi and the sie
so already in ipcor generator within gohan eda

there's a sie or link layer for usb 1.1
and usb 2.0 and you can either use that sie

with an external usb 1.1 or 2.05 or an internal
usb 1.0 or 2.05 also within goin ip core generator

we have a usb 1.1 phi and you can use this on
virtually any of the ios available on any of the

goin devices and so you can instantiate a usb 1.15
inside the fpga providing a you know link layer

with the sie and the phi for 1.1 which is
capable of about 12 megabits per second

lastly what i'm going to go into more detail
is usb 2.0 which is capable of 480 megabits per

second and this is a really challenging ip to do
and that this is why it hasn't been done before

it involves clock data recovery at 480 megabits
which is kind of too low for a lot of the

embedded certes type fpgas but also too fast to
just use gearboxes with over sampling and so we

have a you know we've built a solution around a
recovery method for the megabit signaling using f

gowen's dedicated high-speed i o capabilities and
features and that's a patented solution that we're

really excited about because we've had a number of
requests for usb 2.0 interfacing but haven't been

able to service them and nobody's really in the
market has been able to service them until now so

please reach out to your customers if you've had a
customer that has talked about usb and needing usb

on their products uh we've got we've got the
solution for them and we would really like to

engage and you know make some opportunities
happen with either usb 1.1 or usb 2.0

so the usb 2.0 you know the launch
of usb 2.0 phi is on around may 15th

of 2021 and you'll probably be seeing this
presentation around then so at that time the

latest version of going eda with ipcor generator
will have the usb 2.0 softfi available for use

in in the eda tool so it's already ready to go and
you can virtually again with a few limitations on

the 2.0 because you need to use the the high speed
io but virtually any io any fpga that gowan has an

offering for you can use the usb 2.0 software so
you can have multiple usb 2.05 no problem there

so here's a little bit more focused update going
is now a member of the usb implementers forum and

we have 1.1 and 2.0 solutions so 12 megabits
per second and 480 megabits per second 1.1

is still used a lot for control and just basic
communications and actually usb 1.1 is kind of

included with 2.0 so so 2.0 is actually capable
of a 12 megabit mode and a 480 megabit mode

usb 2 generally has applications that are more
data transfer specific since the data rate is up

um so in ipcor generator we have all
these ips the 1.15 2.05 1.1 and 2.0 sie

and it's kind of defaulted to a virtual com port
scenario but you can use it for other things

we just use that example because it's uh we like
the virtual com port because there are native

drivers within windows 10 windows 7 windows 10 and
linux that makes it very easy to just get started

and i'll explain a little bit more about that
later we also have a usb type-c power delivery

solution and so you can actually you know if
you have customers that are interested in us

usb or usb type-c you can actually combine these
ips together for uh you know a total usb solution

and then lastly we support primarily
just out of the box the virtual comport

type solution because again it's the the
driver capability makes it very easy to use

however there are other device types being
explored like video over usb things like that

and that will just basically as as the solutions
build there will be more um more device types

and you can program these for different
device types that the si is fully programmable

so lots of good opportunities
there for new and unique solutions

okay so now uh we're going to go into just
specifically usb 2.0 finesse ie so this is again

a brand new solution to the fpga market previously
before this solution that only gowan has

you had to use an external phi to interface a
separate chip to interface the uh to interface usb

2.0 with an fpga and there's a patent
pen pending implementation for this

that is uniquely capable on gowen's
high speed and flexible fpga i o

supported in all going devices um with exception
to the 1nz which is our ultra low power device

it has overall lower performance so
that just due to its low power and

so that one's not supported but everything else
is and then devices can support as many usb 2.0

interfaces as the i o permits so that means that
you can do things like a usb hub uh you could do

a hub of you know usb to pcie you could or you
could do or sorry excuse me a pci you could do a

you know you could do the the possibilities are
pretty much endless you can do microphone to usb

you could do multiple microphones to usb you could
do um usb to device to usb host you could do hsic

to usb there are many options and this is just
an interface to allow customers to be creative

with whatever they want to build so now
i'm going to go into usb 2.0 phi and sie

just some information related to it so the usb
2.0 and 1.05 run at 60 megahertz this is native to

the deserialization process and the over sampling
process that's pretty common with all usb

utmi interface fis as well as the sies and
then just 2.0 runs faster so 480 megabits

and usb 1.1 at 12 megabits the resources for
the 2.0 are a little bit larger just under 2k

lookup tables so this can fit in as small as a
2k device and uses five block ram versus the 1.1

solution which is three block ram so you know i
just mentioned this so if you have like a really

tight or cost you know sensitive solution we have
a we've had a lot of customers before we even had

the usb 2.0 solution they would come to us and
say i need a usb 2.0 solution and a lot of them

as we started to communicate with them they
just needed a usb 2.0 solution for basic control

and communication they didn't need the full 480
megabits and there are some i o advantages and

some resource advantages to the 1.1 solution so if
you just need 12 megabits go with the 1.1 solution

don't don't go beyond that and so i would say a
lot of there is a lot of customer opportunity just

for the usb 1.1 solution and then if you need the
extra bandwidth 2.0 is available and this is just

a block diagram of what um what the fi and the sae
look like you know if you were to place both ips

in the fpga and we do have a reference design for
this and basically the phi and the usb sie talk

over a utmi plus interface which is the common
interface between the phi and the link layer

okay usb solution roadmap so 1.1 is available
now 2.05 is just released and these are the

eda numbers that it should be the sie for 2.0 and
1.1 is available now we have reference designs

for virtual com ports virtual com port device id
and then we have a video video over usb solution

that we're working on and then you can expect
other protocols and other examples to follow

we also are working on a csi2 mipi csi2 camera to
usb 2 reference design so this should be pretty

unique and pretty cool kick off about for this
is mid main you should expect it sometime in q3

we also have an hsic reference design in progress
so hsic is basically usb 2.0 for inside inside

embedded devices so it's basically kind of like
usb 2 but inside like let's say a pc and the

benefit of using hsic is that it provides a clock
lane so you don't need the clock data recovery

so it's kind of similar to like mipi csi 2 if
you're familiar with that protocol or maybe dsi or

maybe d5 and this provides both a power and a cost
and a ease of use benefit for situations inside

on on ship or on the board so that's it's used
for things like inside a pc however once you go

outside the pc and you're going over a cable you
can't really send a clock and data over wire pairs

over a cable things get out of alignment and even
if you have alignment capabilities there can be

you know uh issues with the uh the peak to peak
voltage being reduced and things like that so you

need a little bit more advanced recovery system
and so it's best to use fewer wires which just

makes the cable cheaper and embed the
clock within the data which also helps

with the voltage levels um if the data basically
in the when the when the clock is encoded

in the data the way that it's encoded means that
there's an equal balance of zeros and ones which

means that the peak-to-peak voltage doesn't drift
and that's that's the benefit and that's why

we typically use embedded clock on
cable interfacing so but there's a

lot of opportunities for going from hsic for
communication inside on the pcb and then going

out on a cable with usb 2.0 and so that's
exactly why we're building that reference design

so mainly on the usb sie side we have the
device side so it's just a more popular use case

however we have basically for our testing purposes
we have the the code to do a host solution as well

so this would be you'd use the
same fi but you'd be able to do

a host link layer and communicate with usb devices
so this in progress is a little further out but

q4 around that time frame of this year please
let me know if you see any usb 1.1 or 2.0 host

solution needs and we can communicate
and talk about that and see

see make sure we understand their needs and make
sure it's aligned with that target completion date

lastly we have an mjpeg encoder and this is
in progress uh you know sometime around the q4

time range this is needed for things like uh
the csi2 to usb solution um or it may be so

we have it kind of on the roadmap that
it's something that we'd like to do we see

you know some need and if you see any
you know use cases or opportunities there

related or not related to usb please let
us know and we will try to understand those

customers needs as best as possible and
adjust our solution roadmap accordingly

and then also the bridging assps which i talked
about earlier these are application specific chips

that just do the function they do so usb
to jtag usb to spy usb to i2c usb to ur and

i2s audio to and from usb you can expect these
around the q3 time frame and they're they're

currently in testing and so i think that that
that's where on the timeframe will be available

okay so now i'm going to go into use cases now i
have to make it clear that some of these are will

be available and some of them are just theoretical
use cases to start engaging with customers um the

big feat has been conquered which was to get the
usb 1.1 and 2.0 solutions available but now we're

gonna go into you know what you could use it for
and some of these are built like the example here

for usb bridging so usb to jtag usb to spy usb
to i2c usb to ur and i2s audio to and from usb

so yeah this is just a high level diagram of those
same use cases as the assp but we also have them

in fpga solutions as well in case a customer wants
to expand add some buffering some extra features

another usb example is the usb sorry csi2 to usb
solution so here's a diagram of that and then also

usb to dsi so let's say you have a small display
and you want to interface to that display over

over usb that's also possible and that solution
we don't have you know it's not on the roadmap but

if you if you see a customer that is interested
in that we can certainly discuss that with them

okay usb to bluetooth examples so going to or
from bluetooth low energy since we have the gw1 rf

device you can definitely make a usb to bluetooth
low energy dongle so that's pretty unique and this

solution is is not something that's on the roadmap
but would be actually fairly straightforward to

put together i think so please let us know
if you see any opportunities in this area

data and storage buffering so sorry data
shortage and buffering these are just a couple

kind of high-level solution ideas so the one
on the left the diagram on the left is showing

basically using the embedded user flash of the
little b product family the non-volatile family

and use utilizing that that internal flash to
connect to usb 2.0 and so this could be used for

let's say security dongles where you may have some

some key pair in the flash you could also
use this with our secure fpga solution

and this would basically provide a non-volatile
region that you could access over usb 2.0

and then on the right side this is
taking advantage of the extended ps ram

devices the r series devices i mentioned earlier
and it's just showing that you know you got four

to eight megabytes of extended ps ram memory in
the fpga you could also interface to external

memories with the goin device like ddr and you
could have some input data you could buffer it

and then read it out of usb2 at your own pace
or time depending on the application so this is

pretty interesting could be very useful for data
acquisition like data acquisition cards if you've

got you know a bunch of wires monitoring some
system you can store it and then buffer it out

have it buffered and then read
it out on the pc win as needed

this is kind of another idea of a traffic monitor
kind of similar to the data buffering case

where um you basically just have

a usb to usb passthrough but then you can monitor
the usb traffic and particular usb data and

this can be you know really useful as as
a usb snooper line snooper and in fact

you know i use this a lot during deep when i
was debugging um or testing the usb 2.0 solution

but um this can uh you you don't even need
to build a gui for this um you can actually

just use goin's gau going analyzer oscilloscope
so it's our built-in fpga logic analyzer you can

just use that to monitor the data and actually
record it and save it to a file so for you know

debugging solutions traffic monitoring solutions
over usb 2.0 this is a great uh offering

so lastly is kind of the the multi-port hub
concept so as i mentioned you can have multiple

usb phi interfaces and so using the host solution
that's on the roadmap along with the device

solution this allows you to do usb hub and one
thing i left out is there's also opportunity to do

usb hsic for the device interface and then go
out to multiple usb hosts as well so true usb

hub chip and you can make all of the
virtual types of channels and that you want

okay so those are my my kind of high level use
case get your ideas flowing examples and now

i'll talk a little bit about how you can actually
have customers test these examples and get started

so um the the usb 2.0 solution as
well as the 1.1 solution are are

very um robust at this point i feel and uh we
do have a production board that is actually our

dk start gw2a18 board that has been modified
just one of the connectors has been removed

and it's been replaced with the usb 2.0 port
running to the fpga and you can do usb 2.0 or

1.1 with this right now the board is in very
limited supply because we had just our first

test run of the boards but it does work and if you
know there is a high customer need we can get you

one of those boards temporarily and then we have
production availability of that this board around

june 15th so you can expect it on the website
you can expect it um through your distribution

abilities to obtain it and then uh there
also is another internal board that has

just arrived internally and i there is limited
supply but it's another option the nice thing

about this board is that it has a little b and
aurora device on it so if you have a customer

that may want to focus on little b um we're doing
that validation as well this board is also in very

limited supply but we can make exceptions
for particular opportunities that may arise

so in addition to all of this we're building up
the go in design services capabilities um a lot

and so going i call it gds and we're kind of
expanding on this is going design services

it's our applications engineering team providing
design services for customers that want to build

application specific solutions and
they need some design consultations to

get them there maybe they're not so familiar with
fpgas maybe they're a little uncomfortable because

they've never used going fpgas before and they
need a little it could be as simple as just hand

holding some some support to get started it could
be as extreme as doing the whole design for them

and so we're building up a platform to provide
this capability so providing custom application

specific design consultation and providing
hardware as a service is what we like to call it

and uh so as of right now you can it's you
will see this expanding over the next year

but for now we're just basically going
through the info at go on semi email and so

any potential design requests you want to submit
you can either submit them to your go in sales

sales director directly or you can send them
through info go on semi.com you can also just

send them to me i have no problem with that and uh
you can also you know i just put the distribution

page which has access to um you know many of the
distributors and reps that may also be able to

community support you or at least i put
this here just in case this presentation

has a derivative customer facing presentation
and this would provide them the access point to

communicate with you the distributors or the reps
and then for any design service just be ready to

provide us the following we're going to be asking
for it if you send us an email without it so

we need to know the design requirements as
detailed as you can possibly do and one thing

that's very very very helpful that is a lot of
times missing is a technical block diagram if

you can draw a block diagram of it it provides
us a picture of what you want it's very helpful

also you know on the design requirements one
thing that can sometimes be missing as the speeds

that things need to run at that's also useful and
anything you can provide a little bit at a higher

level about the application like if it's using
2.0 what is it interfacing too is it a computer

what kind of data are they going to send things
like that the more information the better

projected volume is really important for us
because it helps us determine our nre structure so

i don't think most customers don't have a problem
with what they're projecting if you could provide

that that would be great and then estimated nre
budget for design development so we really want

to get into the habit of asking this question
because it's often not asked and then it becomes

you know potentially an issue later so you know
you we've got a customer opportunity it comes

into sales we have apps engineers that spend time
to research and and and understand the solution

that needs to be developed and maybe does some
pre-development to make sure that we can do it

and then they come back and say yep we can do it
um how big is the volume you know if the volume

is small then uh we request the nre and the
customer i think feels kind of um a little bit

uh blindsided at that point so we i just
appreciate if we can get into the habit of just

asking um you know do you have an nre estimate
for doing this design for you and if you know if

there's hesitation we say well based on the volume
you know we might not even need it or based on the

roadmap it might be already something we're doing
but we do need to ask because we do spend a lot

of r d budget to to develop these designs and
sometimes you know plans change projects change

so if you could help us help you by just asking
this question up front it'd be very helpful

and then other resources so if you're new
to usb or want to understand more educate

yourself i highly recommend this usb made simple
website it is great it goes through usb 1.1

2.0 it goes through things that i always refer
back to it there's things that i still don't

know about usb and it is on the site so i highly
recommend it if customer has some questions or

you know thoughts it's a great great site to
utilize also the usb 2.0 specification itself

itself is available for free and the usb utmi
interface specification is also available

there are some things i will say that the usb utmi
interface that's the interface between the phi

and the link layer that are discussed in the utmi
specification that i feel are vague in the 2.0

specification and vice versa so um i would if you
know i would provide both um to your customer at

the same time and if you're educating yourself
i would look at both and then below i just have

the social media pages for going something that
your customers can reference i do intend to make a

customer friendly version of this presentation and
video so um that's kind of why it's there and you

can expect that there will probably be some usb
demo videos available and there also is a quick

start guide for the dkstart uh dk dkstar ar18 usb
board so that's a starter guide that allows you to

do a virtual com port data loop so you send data
to the host and then you receive it back and then

it also if you press numbers it will light up
leds so if you press numbers on the keyboard

it will light up a corresponding led and then also
if you push push buttons on the board it will send

a message back to the pc so pretty basic but
pretty cool demo and that's all running at 2.0

and that you could also do it with
1.1 we're not pushing the performance

the performance is native to the protocol when
you're in each mode so basically if you go into

2.0 the packets just transfer faster that's it
for me i hope this was useful please let me know

what i could add or subtract particularly for
the customer facing presentation version of

this and i look forward to helping you go in
by programming for the future thanks a lot